Variable width flat tape head for bi-directional contact recording and method for making the same

ABSTRACT

A variable width flat tape head for bi-directional contact recording and method for making the same has significant advantages over both traditional contoured tape heads and single width flat heads for contact recording applications. The variable width head and process disclosed herein allows for greater ease of manufacturing, efficient layout of the devices on thin film wafers and provides a significant cost reduction in the production of the head compared to traditionally contoured tape heads. In addition, the present invention reduces unnecessary surface area where the tape contacts the head, thus reducing tape wear and damage that is present in single width flat heads (where the tape is in contact uniformly across the tape width), thereby providing a concomitant improvement in tape wear and life. In addition, the head of the present invention is simpler and less costly to manufacture than comparable devices with distinct advantages to the magnetoresistive (“MR”) read element stripe height control process, device alignment and assembly processes, particularly with respect to traditionally contoured tape heads, which require more complex and expensive manufacturing operations to form the tape head profile.

RELATED APPLICATION

[0001] The present application is a continuation-in-part of U.S. PatentApplication Serial No. 09/594,217 filed Jun. 14, 2000, assigned toQuantum Corporation, assignee of the present invention, the disclosureof which is herein specifically incorporated by this reference.

BACKGROUND OF THE INVENTION

[0002] The present invention relates, in general, to the field of datatransducers for magnetic recording. More particularly, the presentinvention relates to a variable width flat tape head for bi-directionalcontact recording and method for making the same.

[0003] The effectiveness of contact recording in magnetic tape drivesdepends, to a large extent, on the spacing between the head and the tapemedium and, as a consequence, conventional contact recording tape headsoften contain a complex contoured surface with which to contact thetape. This contoured surface is comparatively expensive to manufactureand therefore adds significantly to the overall cost of the head. Withcontoured tape heads, however, as the tape speed increases, air can beentrained at the edges with resultant signal loss. In an effort toameliorate this condition, bleed slots (whether transverse orlongitudinal) may be cut into the head to reduce the effect of thisboundary layer of air. However, this only further adds to the cost ofhead production by adding additional manufacturing steps.

[0004] An alternative head design is what is known generally as a “flathead”. These designs are relatively well understood, and it is knownthat they can provide significant advantages over traditionally designedcontoured tape heads. Moreover, a flat head design is simpler to produceand significantly reduces manufacturing costs by eliminating thecontouring processes. However, all flat head designs described to datehave been of a single width.

[0005] The physics surrounding such single width flat head designs havebeen described, inter alia, by Dr. Sinan Muftu in a number of monographson the subject. See for example: The Self Acting, Subambient FoilBearing in High Speed, Contact Tape Recording with a Flat Head, Muftu,S. and Hinteregger, H., Tribology Transactions (Feb. 11, 1997); ContactTape Recording with a Flat Head Contour, Hinteregger, H., and Muftu, S.,IEEE Transactions on Magnetics, Vol. 32. No. 5, September 1996; FlatHeads For Contact Tape Recording: Measurements of PerformanceInsensitivity to Speed, Tension, Stiffness, and wrap Variations,Hinteregger, H., and Muftu, S., Proceedings of the 10th Symposium onInformation Storage and Processing Systems, Santa Clara, Calif. Jun.28-30,1999.

[0006] Regardless of the design chosen, wear of both the tape and thehead will obviously occur at the tape-to-head interface and this wear isdirectly proportional to the area in actual physical contact. Further,with the use of thin-film wafer materials for the production of moreadvanced tape heads, the wafer substrate is often a wear resistantmaterial (e.g. ceramic or aluminum-titanium carbide “Al-TiC”) and wearand damage of the tape can be a significant issue.

SUMMARY OF THE INVENTION

[0007] The variable width flat tape head for bi-directional contactrecording and method of making the same disclosed herein overcomes manyof the limitations of conventional single width flat head designs byincorporating the advantages of variable width to aid in providingoverall performance enhancements and cost effective manufacturability.In this regard, the variable width bi-directional flat head of thepresent invention affords all of the distinct advantages of aconventional single width flat head, while providing importantadvantages over those older designs in the minimization of tape weartogether with significant decreases in manufacturing costs associatedwith the creation of a bi-directional tape head.

[0008] As disclosed herein, the variable width flat tape head design ofthe present invention reduces manufacturing costs by eliminating therequirement to utilize additional wafer space for physically supportingthe tape. In addition, this design eliminates the need for the bondingof ‘wear pads’ adjacent to the device active region to physicallysupport the tape across its entire width to provide uniform contact withthe tape during operation. The variable width flat head design of thepresent invention effectively reduces the area of contact between thehead and the tape, thereby reducing wear and potential damage to thetape during operation. Specifically, the design disclosed hereinexhibits many significant advantages over both traditionally contouredtape heads and single width flat heads and the flat head effect is usedin this design only over the active elements of the head, thus reducingpotential tape damage.

[0009] Among the advantages of the variable width bi-directional flattape head design of the present invention are robust performance over awide range of tape speeds. In this regard, the design affords an actualdecrease in tape-to-head spacing at increasing tape speeds (from ˜50inches per second (“ips”) to 500 ips or more) in contrast totraditionally contoured tape heads where the tape head spacing actuallyincreases with increasing tape speeds. Moreover, the head design of thepresent invention is scalable with the increasing tape speeds requiredto provide for faster data transfer rates.

[0010] The design disclosed herein further provides for more robustperformance at relatively low tape tensions with acceptable tape-to-headspacing required for contact recording being achieved at only about1.0-3.0 oz. These lower tape tensions lead to less tape wear, less poletip recession (“PTR”) or differential wear over the device region andsubstrate and, ultimately to less power being required in the tapetransport motors.

[0011] The outriggers forming a part of the specific embodiment of theinvention illustrated herein, serve to accurately control the wrap angleof the tape about the head in order to essentially achieve a “flat headeffect” at relatively low wrap angles of 0.1 to ˜5.0 degrees.Beneficially, these low wrap angles further provide less wear to thetape medium and the ability to provide a more simplified tape path whenused in a tape drive application. Further, the physics of the variablewidth flat head provided herein scale with the tape width and a singlehead design can be used in conjunction with outriggers of varying lengthin conjunction with a variety of media widths to achieve many possibledifferent form factors while still providing acceptable tape-to-headspacing and potential backwards compatibility.

[0012] Further, the variable width bi-directional flat head design ofthe present invention is robust with respect to head length changes andcan accommodate many active elements within a given length while stillproviding excellent tape-to-head spacing. The head profile provided willalso operate effectively in conjunction with a wide variety of tapetypes (critical parameters include: tape thickness, Young's modulus,tape tension and the like) as opposed to conventional contoured headswhich must be individually designed for a given tape medium havingparticularly defined characteristics in order to minimize entrained airwhich could lead to signal loss or excessive tape damage. Consequently,it can be used in conjunction with a number of differing media and asingle head design (as opposed to many differing designs) is all that isneeded in order to accommodate them.

[0013] Other known advantages of the present design include the factthat there is less head area in actual contact with the tape, leading toa reduction in potential wear and damage of the tape and head ascompared to single-width flat heads and contoured heads. This,naturally, leads to longer tape life. Moreover, the “flat head effect”serves to stabilize the tape over the region of, and between, the activeclusters. This allows for fewer tape disturbances such as flutter andlateral tape motion (“LTM”) of particular benefit in optical servoapplications. In this regard, the design provides an appropriategeometry for the inclusion of an optical sensor to sense optical servomarks on the magnetic side of tape. It further provides for a regionwithin the head structure for the potential inclusion of a lens fordetecting optical servo marks on the data tape including those lying inthe center of two active clusters at the plane of symmetry.

[0014] There are also many manufacturing advantages inherent in thedesign disclosed herein for a variable width bi-directional flat headwhich include significant cost reductions due to its simplicity offabrication and the elimination of many traditionally used processingoperations. The magnetoresistive (“MR”) read element stripe height maybe controlled with a single operation (flat lapping) rather than themultiple steps required in the manufacture of conventional contouredtape heads which require multiple and expensive contour lappingoperations with relatively poor yields due to the fact that stripeheight and contour shape are interdependent variables. Further, in aparticular embodiment, the design of the present invention facilitatesthe alignment of the head active elements in the two device clustersusing a simple fixture rather than expensive optical alignment stationswhich are currently used in the production of conventional contouredheads. Moreover, the outriggers utilized in the present invention may beeasily assembled to precisely control wrap angles necessary to inducethe “flat head effect” over bi-directional cluster region. Through anefficient use of head wafer real-estate, no wafer space is “sacrificed”to provide mechanical support to the full width of the tape, as isrequired in traditional single width flat heads.

[0015] Overall, the simplicity of manufacture of the design of thepresent invention leads to: a reduction in the need for expensivemanufacturing or processing capital equipment expenditures; a reductionin processing consumables (e.g. no need for the conventional diamondtape used for contour lapping); a reduction in manufacturing labor; areduction in total processing time with a concomitant reduction in“Work-In-Process” (“WIP”) with an increase in head yield due to thesimplicity and elimination of operations, especially stripe heightcontrol.

[0016] Particularly disclosed herein is a variable width flat tape headfor bi-directional contact recording. The method for making the same hassignificant advantages over both traditional contoured tape heads andsingle width flat heads for contact recording applications. The variablewidth head and process disclosed herein allows for greater ease ofmanufacturing, efficient layout of the devices on thin film wafers andprovides a significant cost reduction in the production of the headcompared to traditionally contoured tape heads. In addition, the presentinvention reduces unnecessary surface area where the tape contacts thehead, thus reducing tape wear and damage that is present in single widthflat heads, (where the tape is in contact uniformly across the tapewidth), thereby providing a concomitant improvement in tape wear andlife. In addition, the head of the present invention is simpler and lesscostly to manufacture than comparable devices with distinct advantagesto the MR read element stripe height control process, device alignmentand assembly processes, particularly with respect to traditionallycontoured tape heads which require more complex and expensivemanufacturing operations to form the tape head profile.

BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The aforementioned and other features and objects of the presentinvention and the manner of attaining them will become more apparent andthe invention itself will be best understood by reference to thefollowing description of a preferred embodiment taken in conjunctionwith the accompanying drawings, wherein:

[0018]FIG. 1 is a top plan view of an embodiment of the variable widthbi-directional flat head of the present invention illustrating thebonding of a pair of active device region clusters and the associatedoutriggers;

[0019]FIG. 2 is a more detailed illustration of one of the pair ofactive device clusters illustrating the active device region and a capbonded to the wafer;

[0020]FIG. 3A and 3B are top plan and side elevational viewsrespectively of a capped row of active device region clustersillustrative of a number of bond pads affixed to a wafer having a deviceregion sputtered onto the wafer substrate and an adhesive groovedisposed in the cap;

[0021]FIG. 4A and 4B are top plan and side elevational viewsrespectively of another embodiment of a pair of active device regionclusters bonded together along a central bond line and including aceramic base including a number of adhesive grooves disposed therein;

[0022]FIG. 5A and 5B are differing isometric views of embodiments ofcaps for possible use with varying embodiments of the present inventionillustrating a single, centrally located longitudinal adhesive grooveand a pair of generally parallel and spaced apart longitudinal adhesivegrooves respectively;

[0023]FIG. 6A and 6B are differing isometric views of embodiments ofoutriggers as previously illustrated for use in conjunction with thepresent invention showing an adhesive bonding surface and longitudinallyextending adhesive groove for affixing the outriggers to an associatedactive device region cluster;

[0024]FIG. 7A and 7B are top plan and side elevational viewsrespectively of the pair of active device region clusters as previouslyillustrated in FIGS. 4A and 4B, including the bonding of a pair ofoutriggers as shown in FIG. 6B thereto; and

[0025]FIG. 8 is a simplified side elevational view of a portion of aprocess for bonding a plurality of caps to a number of wafer clusters,wafer sections or whole wafers and illustrating the bonding fixture baseand top for effectuating the same.

[0026]FIG. 9 is a top view of a bi-directional flat head according tothe present invention in which the head outriggers are wider than thetape and mechanically support the tape across the full width thereof;

[0027]FIG. 10 is a top view of a bi-directional flat head according tothe present invention in which the tape is wider than the headoutriggers, in which the ends of the outriggers may be beveled orslightly edge-blended to prevent tape damage;

[0028]FIG. 11 is top view of a bi-directional flat head according to thepresent invention in which the head may be pitched at an angle relativeto the tape path to facilitate azimuth recording;

[0029]FIG. 12 is a top view of a bi-directional flat head according tothe present invention including an asymmetric placement of theoutriggers, in which an end portion of the outriggers is optionallyslightly beveled to prevent tape damage;

[0030]FIG. 13 is a top view of the head of FIG. 12 and further includingmounting, laser, optics, or other sensors requiring a relatively stabletape region;

[0031]FIG. 14 is a top of a bi-directional flat according to the presentinvention including an alternative asymmetric placement of theoutriggers;

[0032]FIG. 15 is a top view of the head of FIG. 14 and further includingmounting, laser, optics, or other sensors;

[0033]FIG. 16 is a top view of a bi-directional head according to thepresent invention in which the length of the outriggers is relativelyshort compared to the length of the head region;

[0034]FIG. 17 is a top view of a bi-directional head according to thepresent invention in which the length of the outriggers is relativelylong compared to the length of the head region;

[0035]FIG. 18 is a top view of a bi-directional head according to thepresent invention in which the outriggers further include an additionalset of recessed outriggers used to accurately control the wrap angle tothe flat head region;

[0036]FIG. 19 is a side view of the bi-directional head of FIG. 18;

[0037]FIG. 20 is a top view of two bi-directional flat heads assembledand merged according to the present invention in which the two heads aremounted at a shallow angle with respect to each other such that the tapepath wraps over each outrigger;

[0038]FIG. 21 is a side view of the two bi-directional flat heads shownin FIG. 20; and

[0039]FIG. 22 is a top view and corresponding side views of adouble-cluster flat head having recessed outriggers on all four sidesfor accurately controlling tape wrap on all sides of the head.

DESCRIPTION OF A PREFERRED EMBODIMENT

[0040] With reference now to FIG. 1, a top plan view of a representativeembodiment of a variable width bi-directional flat head 10 in accordancewith the present invention is shown. The head 10 comprises, in pertinentpart, a pair of active device clusters 12 comprising clusters 14A and14B. As illustrated, clusters 14A and 14B may be manufactured from asingle wafer and then bonded back-to-back along bondline 16.

[0041] Each of the clusters 14A and 14B then incorporates a respectiveactive device region 18A and 18B which may comprise a magnetoresistive(“MR”) sensor. A pair of cantilevered outriggers 20A and 20B is bondedto the lateral sides of the respective clusters 14A and 14B in agenerally parallel and spaced apart relationship to each other. Theoutriggers 20A and 20B may each serve as a leading and trailing edgeoutrigger depending on the motion of the tape and each extends from arespective medial point of attachment 24A and 24B to the cluster pair 12to a respective distal point 26A and 26B.

[0042] With reference additionally now to FIG. 2, a more detailedillustration of one of the pair of active device clusters 14B is shownincluding the active device region 18B. In this view, it is seen that acap 22 may be bonded to the lateral side of the clusters 14A and 14Bprior to the bonding of the outriggers 20A and 20B respectively.

[0043] The bi-directional variable width flat head 10 can be seen tocomprise a variable width surface where the “flat head effect” may beachieved in operation. This effect is a desired result and, inoperation, is due to the suction created over the tape head as aconsequence of the tape being “over-wrapped” at the leading edge.Definitionaly, “over-wrapped” tape is considered to be fromapproximately 0.1 to ˜4.0 degrees of wrap with respect to the tape headsurface. In any event, through the use of the design of the presentinvention, this effect is induced over a portion of the head 10 forcontact recording over sets of active elements 18A and 18B. However, theeffective width presented in the design disclosed varies in such a wayas to minimize unnecessary contact of the head 10 with the tape duringits operation.

[0044] In the particular embodiment of the present inventionillustrated, two sets of active elements or “device clusters” 14A and14B have been bonded together. A cap 22 is bonded over the activeelement region of each cluster 14A and 14B in order to protect theactive elements 18A and 18B respectively from wear from the data tapeduring contact recording. These clusters 14A and 14B are flat lapped in“row bars” to achieve MR stripe height control. Two capped rows ofclusters 14A and 14B may then be bonded together to provide a set offorward and reverse sets of active elements 18A and 18B. A simplefixture may be used for this assembly. The active elements 18A and 18Bare aligned to be adjacent to each other by the use of a precisegrinding cut and precise fixture. Once bonded and aligned, dual clusters14A and 14B are cut out of the bonded row bars.

[0045] This double cluster pair 12 is itself relatively narrow indimensions and cannot itself mechanically support the tape across thehead 10 in operation. Therefore, bonded to the leading and trailingedges (or sides) are two outriggers 20A and 20B, which mechanicallysupport the data tape during operation. In addition, the outriggers 20Aand 20B provide wrap angle control to induce the “flat head effect”(suction of the tape down to the head 10) along both the leading one ofthe outriggers 20A and 20B, the entire double cluster pair 12 with bothforward and reverse active elements 18A and 18B. The trailing one of theoutriggers 20A and 20B provides mechanical support for the tape,however, it does not itself serve to induce the “flat head effect”because the tape is not “over-wrapped” over the leading edge of thisparticular outrigger 20A or 20B. This also serves to minimize wear onthe tape.

[0046] With respect to the cap 22, this material may be applied to thewafer row or wafer cluster prior to flat lapping in order that the flaplapping process can remove any discontinuities between the cap 22 andthe wafer surfaces. The cap 22 material should be selected to match themechanical properties of the wafer substrate material as to coefficientof thermal expansion, hardness, fracture toughness, elastic modulus andthe like and it serves to protect the wafer devices from wear duringcontact recording. In a particular embodiment of the present invention,the cap may comprise, for example, alumina titanium carbide (Al-TiC).

[0047] With reference additionally now to FIG. 3A and 3B, top plan andside elevational views respectively of a capped row of active deviceregion clusters 30 are shown illustrative of a number of bond pads 34being affixed to a wafer 32 having a device region sputtered 38 onto thewafer substrate 40 and an adhesive groove 42 disposed in the cap 36. Itshould be noted that any number of clusters might be provided along aparticular row. After the cap 36 has been bonded to the waferrow/cluster by filling the adhesive groove 42 with adhesive material, itmay be flat lapped for purposes of maintaining the MR stripe heightcontrol. This then creates a uniform surface between the cap 36 andwafer 32 material. The adhesive groove 42 can be used to minimize theamount of adhesive exposed in the bondline between the wafer 32 and cap36.

[0048] With reference additionally now to FIG. 4A and 4B, top plan andside elevational views respectively of another embodiment of a pair ofactive device region clusters 50 are shown bonded together along acentral bond line 16 and including a ceramic base 52, including a numberof adhesive grooves 56 (filled with adhesive) disposed therein in anupper surface 54 thereof. With respect to the pair of active deviceregion clusters depicted, like structure to that previously illustratedand described has been like numbered and the foregoing descriptionthereof shall suffice herefor. With respect to the particular embodimentof the present invention illustrated, it should be noted that the lengthof the ceramic base 52 might be the same as the length of the clusterpair or rows of clusters that have been bonded together. The adhesivegrooves 56 in the upper surface 54 of the base 52 may or may not beincluded, depending upon the particular application.

[0049] As previously described, the base 52 may be bonded at the uppersurface 54 thereof to the capped clusters as shown. It providesadditional strength for bonding the cluster pairs and rows of clusterpairs together. Preferably, the base may comprise polished ceramicmaterial similar to the wafer substrate material or other materialhaving corresponding mechanical properties such as its coefficient ofthermal expansion, Young's Modulus and the like. As illustrated,adhesive grooves 56 may be added along the upper surface 54 to aidalignment of the clusters and provide grooves for retaining an adhesive.

[0050] In the embodiments previously described and illustrated, as wellas those which will be described hereinafter, the adhesive for formingthe cluster pairs, affixing the outriggers, bonding the base and thelike may any suitable substance such as a reactive urethane acrylicadhesive with preferably low stress and room temperature cureproperties. The adhesive may contain silver (Ag) or other electricallyconductive particles for use in potentially grounding and/or shieldingthe two device clusters. In general, all component elements to beassembled should be cleaned prior to assembly and bonding.

[0051] In a particular embodiment, the adhesive for affixing the cap 36may comprise an aromatic amine, which may be frozen, with a glasstransition temperature Tg˜130° Celsius and a viscosity of v˜350centipoise. In general, the adhesive used should be chemicallyresistant, as well as provide sufficient mechanical strength formultiple post-wafer processing steps. This particular adhesive requiresan oven cure step.

[0052] The adhesive for affixing the outriggers 20A and 20B (FIGS. 1 and2) may be selected depending upon whether the outrigger 20 is utilizeditself as a cap (thereby eliminating a separate cap 22) or whether it isbonded to the capped cluster. The requirements for the adhesive dependupon how much processing stress (thermal, mechanical, chemical, etc.)the outrigger 20 bondline will be exposed to and on the deformationrequirements of the bonded part (i.e. an oven cure adhesive processinduces additional deformation as compared to low-shrinkage roomtemperature cure adhesive). In general, where the outrigger 20 is itselfutilized as a cap, the selected adhesive may be the same as utilized toaffix the cap 22 itself (using an oven cure). In those instances inwhich the outrigger 20 is bonded to a cap 22, the selected adhesive maybe the same as utilized in forming the cluster pair (using a roomtemperature cure).

[0053] With reference additionally now to FIG. 5A and 5B, differingisometric views of embodiments of caps 36 for possible use with varyingembodiments of the present invention are shown illustrating a single,centrally located longitudinal adhesive groove 42 in the first instanceand a pair of generally parallel and spaced apart longitudinal adhesivegrooves 42A and 42B in the second respectively.

[0054] With reference additionally now to FIG. 6A and 6B, differingisometric views of embodiments of outrigger 20, as previouslyillustrated for use in conjunction with the present invention, are showndepicting an adhesive bonding surface 60 in the first instance and alongitudinally extending adhesive groove 62 formed in the adhesivebonding surface 60 in the second instance, for affixing the outriggers20 to an associated active device region cluster.

[0055] The outrigger 20 material should be selected to be, for example,a wear resistant ceramic generally matching the mechanical and thermalproperties of he cap 36 and wafer substrate materials such as Al-TiC. Asnoted previously, the outrigger 20 may be bonded to the individual waferclusters directly to serve as both a cap and outrigger. In thisinstance, the outrigger 20 may include an adhesive groove 62 as shown.An outrigger 20 bonded to a single cluster may be flat lapped together.Two double clusters, each having a bonded outrigger 20 may be bondedtogether thereby requiring a fixture to accommodate thecluster-outrigger pair, unlike the double cluster pair previouslydescribed.

[0056] With reference additionally now to FIG. 7A and 7B, top plan andside elevational views respectively of a pair of active device regionclusters 70 as previously illustrated in FIGS. 4A and 4B are shownincluding the bonding of a pair of outriggers 20 as shown in FIG. 6B.With respect to these figures, like structure to that previouslyillustrated and described has been like numbered and the foregoingdescription thereof shall suffice herefor.

[0057] With reference additionally now to FIG. 8, a simplified sideelevational view of a portion of a process 80 for bonding a plurality ofcaps 36 to a number of wafer clusters 82, wafer sections or whole wafersis shown also illustrating the bonding fixture base 84 and top 86 foreffectuating the bonding process. The fixture base 84 holds the caps 36in correct alignment for bonding while a force in the direction of thearrow is applied to the top 86 during the cure process.

[0058] Referring now to FIG. 9, a data transducer for accessing data ona tape medium 90 of a predetermined width includes at least onegenerally rectilinear cluster 94 having opposing ends and orthogonallateral sides, and an active device region formed in the cluster. A pairof parallel and spaced-apart cantilevered outriggers 92A and 92B areaffixed to the lateral sides of the cluster and extend outwardly fromthe opposing ends. The end portion of the outriggers 92A and 92B can bebeveled or slightly edge-blended to prevent tape damage, for example, inthe case where the head moves in a transverse direction to the tapetransport direction. In FIG. 9, the pair of outriggers 92A and 92B areof sufficient length to extend beyond the width of the tape medium 90and mechanically support the full width of the tape.

[0059] Referring now to FIG. 10, the data transducer cluster 94 andoutriggers 92A and 92B are sized so that the width of the tape medium 90extends beyond the length of the pair of outriggers 92A and 92B.

[0060] Referring now to FIG. 11, the entire data transducer cluster 94and outriggers 92A and 92B are pitched at an angle relative to the tapemedium 90 to allow azimuth recording. The outriggers 92A and 92B can besized as shown in either of previous FIGS. 9 or 10.

[0061] Referring now to FIG. 12, a data transducer cluster 94 is shownin which the pair of outriggers 92A and 92B are asymmetrically affixedto the lateral sides of the cluster 94 to form a first, longer portiondesignated “A” and a second, shorter portion designated “B”. Circularareas 96 generally show, as previously described, an end portion ofoutriggers 92A and 92B that may be slightly beveled for prevention oftape damage.

[0062] In FIG. 13, the data transducer further includes a sensor 98mounted within the first portion of the pair of outriggers 92A and 92B.In region “A” the outriggers 92A and 92B can support sensors forpositioning of optics, lasers, and the like, and can be adjustedanywhere within the “A” region as shown.

[0063] In FIGS. 14 and 15, an additional asymmetric placement of theoutriggers 92A and 92B is shown corresponding to the descriptions abovewith reference to FIGS. 12 and 13, respectively.

[0064] In FIG. 16 a top view of the transducer 94 is shown in which therelative length of the outriggers 92A and 92B is short with respect tothe length of the head region (A<B). In FIG. 17 a top view of thetransducer 94 is shown in which the relative length of the outriggers92A and 92B is long with respect to the length of the head region (A>B).

[0065] Referring now to FIG. 18, a plan view of a data transducercluster 94 includes a second pair of generally parallel and cantileveredoutriggers affixed to the first pair of outriggers to form combinationoutriggers 100A and 100B as shown. In FIG. 19, the side view shows thatthe second pair of outriggers is set back from the first pair ofoutriggers in order to establish a predetermined accurate tape mediumwrap angle, θ.

[0066] An example of two variable-width flat heads assembled and mergedseparately is shown in FIG. 20. The data transducer assembly includesfirst and second clusters 94 bonded together proximately at one of thelateral sides and pitched with respective to each other in order toestablish a predetermined tape medium wrap pitch angle, ψ. In FIG. 20,two pairs of outriggers 92A and 92B, flat heads 94, and asymmetricactive regions 102 are shown. In the side view of FIG. 21, the wrappitch angle, ψ, is more clearly shown. The two variable width flat heads94 are pitched with respect to each other in order to establish wrapangles over the outriggers 92A and 92B to induce desirable flat headphysics of the head regions.

[0067] An example of a double-cluster flat head 94 with“mini-outriggers” 106 and 108 for accurately controlling tape wrap onall side of the head 94 is shown in FIG. 22. The data transducerincludes at least one generally rectilinear cluster 94 having opposingends and lateral sides, an active device region formed within thecluster, a first pair of generally parallel and spaced apartcantilevered outriggers 106 affixed to the lateral sides, and a secondpair of generally parallel and spaced apart cantilevered outriggers 108affixed to said opposing ends. Outrigger 108 is recessed a predetermineddistance 114 from the surface of flat head 94 and spaced apart from flathead 94 by gap 116. Outrigger 106 is recessed a predetermined distance110 from the surface of flat head 94 and spaced apart from flat head 94by gap 112.

[0068] As previously noted, all parts and components, including thealignment fixture, should be cleaned and the surfaces specially preparedfor the process 80. The parts to be assembled in the fixture are treatedwith an activator and adhesive (which may include an ultra-violet “UV”activator to enhance bonding) and a weight, or force, is applied untilthe adhesive cures. In general, the bonding fixture may be also made outof a ceramic material (in order to generally match the thermalproperties of the cap and wafer material) which can be machined forprecision surfaces. The fixture can be made for capping rows andclusters over portions of a wafer or the entire wafer itself. Since thebonding fixture will be thermally cycled, it must be designed towithstand this operation.

[0069] While there have been described above the principles of thepresent invention in conjunction with a specific head structure andoutrigger configuration, it is to be clearly understood that theforegoing description is made only by way of example and not as alimitation to the scope of the invention. Particularly, it is recognizedthat the teachings of the foregoing disclosure will suggest othermodifications to those persons skilled in the relevant art. Suchmodifications may involve other features which are already known per seand which may be used instead of or in addition to features alreadydescribed herein. Although claims have been formulated in thisapplication to particular combinations of features, it should beunderstood that the scope of the disclosure herein also includes anynovel feature or any novel combination of features disclosed eitherexplicitly or implicitly, or any generalization or modification thereofwhich would be apparent to persons skilled in the relevant art, whetheror not such relates to the same invention as presently claimed in anyclaim and whether or not it mitigates any or all of the same technicalproblems as confronted by the present invention. The applicants herebyreserve the right to formulate new claims to such features and/orcombinations of such features during the prosecution of the presentapplication or of any further application derived therefrom.

I claim:
 1. A data transducer for accessing data on a tape medium of apredetermined width, said transducer comprising: at least one generallyrectilinear cluster presenting opposing ends and lateral sides thereof;an active device region formed within said at least one cluster; and afirst pair of generally parallel and spaced apart cantileveredoutriggers affixed to said lateral sides of said cluster extendingoutwardly from said opposing ends thereof.
 2. A data transducer as inclaim 1 in which at least one end portion of one of said outriggers isbeveled.
 3. A data transducer as in claim 1 in which at least one ofsaid first pair of outriggers are of sufficient length to extend beyondthe width of said tape medium.
 4. A data transducer as in claim 1 inwhich the width of said tape medium extends beyond the length of saidfirst pair of outriggers.
 5. A data transducer as in claim 1 in whichthe entire data transducer is pitched at an angle relative to said tapemedium to allow azimuth recording.
 6. A data transducer as in claim 1 inwhich said first pair of outriggers is asymmetrically affixed to saidlateral sides of said cluster to form a first, longer portion and asecond, shorter portion.
 7. A data transducer as in claim 6 furthercomprising a sensor mounted within said first portion of said pair ofoutriggers.
 8. A data transducer as in claim 1 further comprising asecond pair of generally parallel and cantilevered outriggers affixed tosaid first pair of outriggers.
 9. A data transducer as in claim 8 inwhich said second pair of outriggers is set back from said first pair ofoutriggers in order to establish a predetermined tape medium wrap angle.10. The data transducer of claim 1 wherein said at least one clustercomprises: first and second clusters bonded together at one of saidlateral sides thereof and pitched with respective to each other in orderto establish a predetermined tape medium wrap angle.
 11. A datatransducer for accessing data on a tape medium of a predetermined width,said transducer comprising: at least one generally rectilinear clusterpresenting opposing ends and lateral sides thereof; an active deviceregion formed within said at least one cluster; and a first pair ofgenerally parallel and spaced apart cantilevered outriggers affixed tosaid lateral sides; and a second pair of generally parallel and spacedapart cantilevered outriggers affixed to said opposing ends.